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Features:
1. Dual CLIP bonding structure to enhance bonding efficiency;
2. Equipped with motion shot for monitoring CLIP status;
3. Visual recognition and correction of bonding positions to improve bonding accuracy;
4. Post-bonding inspection for real-time identification of defective products;
5. Serial connection for automatic left-in and right-out die loading and unloading;
6. Self-developed software operation and control platform for intelligent equipment operation
In the past decade, the LED industry has focused on lighting...
At the packaging end, due to the production rhythm being con...
From the perspective of packaging, I divide LED display scre...
In recent years, with the rapid development of the panel ind...
Hotline：0755-29691921
Phone：0755-29691921
Fax：0755-29691921
Email：market@asmade.cn
Address：Building 3, Xifengcheng Industrial Park, Fuhai Street, Bao'an District, Shenzhen City, Guangdong Province
official account
0755-29691921
