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Features:
1. Dual CLIP bonding structure to enhance bonding efficiency;
2. Equipped with motion shot for monitoring CLIP status;
3. Visual recognition and correction of bonding positions to improve bonding accuracy;
4. Post-bonding inspection for real-time identification of defective products;
5. Serial connection for automatic left-in and right-out die loading and unloading;
6. Self-developed software operation and control platform for intelligent equipment operation
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Phone:0755-29691921
Fax:0755-29691921
Email:market@asmade.cn
Address:Building 3, Xifengcheng Industrial Park, Fuhai Street, Bao'an District, Shenzhen City, Guangdong Province
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