Automatic Clip Bonding Solution AS2001
2024-10-14(622)Browse
Features:
1. Adopt stencil printing to improve printing efficiency and precision
2. Use a turret bonder with adjustable bonding angles and pressures
3. Optional secondary printing on silicon wafers to achieve stacked packaging
4. Equipped with CLIP bonding with motion shot for position correction and post-bonding inspection
5. Utilize a Formic Acid Vacuum Reflow Oven to enhance welding yield and improve machine stability
6. Self-developed software operation and control platform for intelligent equipment operation
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